Display device having a plurality of discharge holes

ABSTRACT

A display device may include a substrate including a display area and a non-display area surrounding at least a portion of the display area, a first organic insulating layer disposed on the substrate in the non-display area, a first conductive layer disposed on the first organic insulating layer and including first discharge holes, a second organic insulating layer disposed on the first conductive layer, and a transparent conductive layer disposed on the second organic insulating layer and including second discharge holes that respectively overlap the first discharge holes.

CROSS REFERENCE TO RELATED APPLICATION(S)

This application claims priority from and the benefit of Korean PatentApplication No. 10-2020-0130284, filed on Oct. 8, 2020, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Embodiments of the invention relate generally to a display device.

Discussion Of The Background

A display device may include a light emitting element including a holeinjection electrode, an electron injection electrode, and an emissionlayer disposed therebetween. The light emitting element may emit lightwhen excitons generated by combining holes injected from the holeinjection electrode and electrons injected from the electron injectionelectrode in the emission layer fall from an excited state to a groundstate.

The display device may include an inorganic insulating layer and/or anorganic insulating layer to insulate between stacked conductive layers.Due to short-term or long-term chemical decomposition of organicmaterials contained in the organic insulating layer, the organicinsulating layer may generate gas. When the gas generated in the organicinsulating layer flows into the light emitting element, pixel shrinkage,dark spots, or the like may be induced.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Embodiments provide a display device configured to prevent a lightemitting element from being damaged.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

A display device according to an embodiment may include a substrateincluding a display area and a non-display area surrounding at least aportion of the display area, a first organic insulating layer disposedon the substrate in the non-display area, a first conductive layerdisposed on the first organic insulating layer and including firstdischarge holes, a second organic insulating layer disposed on the firstconductive layer, and a transparent conductive layer disposed on thesecond organic insulating layer and including second discharge holesthat respectively overlap the first discharge holes.

In an embodiment, a width of each of the second discharge holes may besubstantially equal to a width of each of the first discharge holes.

In an embodiment, the first conductive layer may include aluminum (Al)and titanium (Ti).

In an embodiment, the transparent conductive layer may include silver(Ag) and indium tin oxide (ITO).

In an embodiment, each of the first organic insulating layer and thesecond organic insulating layer may include polyimide (PI).

In an embodiment, the display device may further include pixels disposedon the substrate in the display area and a power line disposed on thesubstrate in the non-display area, providing a power voltage to thepixels, and including the first conductive layer and the transparentconductive layer.

In an embodiment, the power line may include a first portion spacedapart from the display area by a first distance and a second portionspaced apart from the display area by a second distance greater than thefirst distance. The first discharge holes and the second discharge holesmay be disposed in the first portion.

In an embodiment, the first conductive layer may further include thirddischarge holes. The second conductive layer may further include fourthdischarge holes that do not respectively overlap the third dischargeholes. The third discharge holes and the fourth discharge holes may bedisposed in the second portion.

In an embodiment, the third discharge holes and the fourth dischargeholes may be alternately disposed in a plan view.

In an embodiment, the non-display area may include a first side portionin which a pad connected to the power line is disposed, a corner portionextending from the first side portion and having a curved shape, and asecond side portion extending from the corner portion and having astraight shape. The first portion may be disposed in the first sideportion.

In an embodiment, the second portion may be disposed in the cornerportion.

In an embodiment, the second portion may be disposed in the second sideportion.

In an embodiment, the display device may further include a transistordisposed on the substrate in the display area, a first planarizationlayer disposed on the transistor, a first connection electrode disposedon the first planarization layer and connected to the transistor, asecond planarization layer disposed on the first connection electrode, apixel electrode disposed on the second planarization layer and connectedto the first connection electrode, an emission layer disposed on thepixel electrode, and an opposite electrode disposed on the emissionlayer.

In an embodiment, the first organic insulating layer may be disposed onthe same layer as the first planarization layer. The first conductivelayer may be disposed on the same layer as the first connectionelectrode. The second organic insulating layer may be disposed on thesame layer as the second planarization layer. The transparent conductivelayer may be disposed on the same layer as the pixel electrode.

In an embodiment, the display device may further include a secondconductive layer disposed between the second organic insulating layerand the transparent conductive layer and including fifth discharge holesthat respectively overlap the first discharge holes, and a third organicinsulating layer disposed between the second conductive layer and thetransparent conductive layer.

In an embodiment, the second conductive layer may include aluminum (Al)and titanium (Ti).

In an embodiment, the third organic insulating layer may includepolyimide (PI).

In an embodiment, the display device may further include a secondconnection electrode disposed between the second planarization layer andthe pixel electrode and connecting the first connection electrode andthe pixel electrode, and a third planarization layer disposed betweenthe second connection electrode and the pixel electrode.

In an embodiment, the second conductive layer may be disposed on thesame layer as the second connection electrode. The third organicinsulating layer may be disposed on the same layer as the thirdplanarization layer.

In an embodiment, the transparent conductive layer may be connected tothe opposite electrode.

In the display device according to the embodiments, the second dischargeholes of the transparent conductive layer may respectively overlap thefirst discharge holes of the first conductive layer, so that gasesgenerated in the first organic insulating layer disposed in thenon-display area may be smoothly discharged through the first dischargeholes and the second discharge holes. Accordingly, the light emittingelement disposed in the display area may not be damaged by the gasesdischarged from the first organic insulating layer.

It is to be understood that both the foregoing general description andthe following detailed description are illustrative and explanatory andare intended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate illustrative embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1 is a plan view illustrating a display device according to anembodiment.

FIG. 2 is a cross-sectional view illustrating a display area in FIG. 1 .

FIG. 3 is a plan view illustrating a non-display area in FIG. 1 .

FIG. 4 is a cross-sectional view illustrating the display device takenalong a line I-I′ in FIG. 3 .

FIG. 5 is a plan view illustrating a display device according to anembodiment.

FIG. 6 is a plan view illustrating an area II in FIG. 5 .

FIG. 7 is a plan view illustrating a non-display area in FIG. 5 .

FIG. 8 is a cross-sectional view illustrating the display device takenalong a line in FIG. 7 .

FIGS. 9 and 10 are cross-sectional views illustrating a display deviceaccording to an embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various embodiments may bepracticed without these specific details or with one or more equivalentarrangements. In other instances, well-known structures and devices areillustrated in block diagram form in order to avoid unnecessarilyobscuring various embodiments. Further, various embodiments may bedifferent, but do not have to be exclusive. For example, specificshapes, configurations, and characteristics of an embodiment may be usedor implemented in another embodiment without departing from theinventive concepts.

Unless otherwise specified, the illustrated embodiments are to beunderstood as providing illustrative features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anembodiment may be implemented differently, a specific process order maybe performed differently from the described order. For example, twoconsecutively described processes may be performed substantially at thesame time or performed in an order opposite to the described order.Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the D1-axis, the D2-axis,and the D3-axis are not limited to three axes of a rectangularcoordinate system, such as the x, y, and z-axes, and may be interpretedin a broader sense. For example, the D1-axis, the D2-axis, and theD3-axis may be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. As used herein,the term “and/or” includes any and all combinations of one or more ofthe associated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the term“below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various embodiments are described herein with reference to sectionaland/or exploded illustrations that are schematic illustrations ofidealized embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments disclosed herein should not necessarily beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. In this manner, regions illustrated in the drawings maybe schematic in nature and the shapes of these regions may not reflectactual shapes of regions of a device and, as such, are not necessarilyintended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

Hereinafter, display devices in accordance with embodiments will beexplained in detail with reference to the accompanying drawings.

FIG. 1 is a plan view illustrating a display device according to anembodiment.

Referring to FIG. 1 , a display device 100 according to an embodimentmay include a substrate 110 including a display area DA and anon-display area NDA. The display area DA may be an area that displaysan image.

The non-display area NDA may surround at least a portion of the displayarea DA. In an embodiment, the non-display area NDA may entirelysurround the display area DA. The non-display area NDA may be an areathat does not display an image.

FIG. 2 is a cross-sectional view illustrating the display area DA inFIG. 1 .

Referring to FIGS. 1 and 2 , the display device 100 may include a bufferlayer 120, an active layer 130, a first gate insulating layer 140, agate electrode 150, a second gate insulating layer 160, a second gateelectrode 170, an interlayer insulating layer 180, a source electrode191, a drain electrode 192, a first planarization layer 200, a firstconnection electrode 210, a second planarization layer 220, a pixelelectrode 250, a pixel defining layer 260, an emission layer 270, and anopposite electrode 280 disposed on the substrate 110 in the display areaDA.

The substrate 110 may be a transparent insulating substrate. In anembodiment, the substrate 110 may have rigid characteristics. In such anembodiment, the substrate 110 may include, for example, glass, quartz,metal, or the like. In another embodiment, the substrate 110 may haveflexible characteristics. In such another embodiment, the substrate 110may include polymer resin such as polyethersulfone (PES), polyacrylate,polyetherimide (PEI), polyethylene naphthalate (PEN), polyethyleneterephthalate (PET), polyphenylene sulfide (PPS), polyarylate (PAR),polyimide (PI), polycarbonate (PC), cellulose acetate propionate (CAP),or the like.

The buffer layer 120 may be disposed on the substrate 110. The bufferlayer 120 may block impurities from flowing through the substrate 110.Further, the buffer layer 120 may provide a flat upper surface on thesubstrate 110. The buffer layer 120 may include an inorganic insulatingmaterial such as silicon nitride, silicon oxide, silicon oxynitride, orthe like.

The active layer 130 may be disposed on the buffer layer 120. In anembodiment, the active layer 130 may include amorphous silicon,polycrystalline silicon, or the like. In another embodiment, the activelayer 130 may include an oxide semiconductor. For example, the oxidesemiconductor may include at least one oxide of indium (In), gallium(Ga), zinc (Zn), tin (Sn), titanium (Ti), zirconium (Zr), and hafnium(Hf).

The first gate insulating layer 140 may be disposed on the active layer130. The first gate insulating layer 140 may cover the active layer 130on the buffer layer 120. In an embodiment, the first gate insulatinglayer 140 may have a uniform thickness along the profile of the activelayer 130. In another embodiment, the first gate insulating layer 140may have a flat upper surface. The first gate insulating layer 140 mayinclude an inorganic insulating material such as silicon nitride,silicon oxide, silicon oxynitride, or the like.

The first gate electrode 150 may be disposed on the first gateinsulating layer 140. The first gate electrode 150 may overlap theactive layer 130. The first gate electrode 150 may include a conductivematerial such as molybdenum (Mo), copper (Cu), aluminum (Al), titanium(Ti), or the like.

The second gate insulating layer 160 may be disposed on the first gateelectrode 150. The second gate insulating layer 160 may cover the firstgate electrode 150 on the first gate insulating layer 140. In anembodiment, the second gate insulating layer 160 may have a uniformthickness along the profiles of the first gate insulating layer 140 andthe first gate electrode 150. In another embodiment, the second gateinsulating layer 160 may have a flat upper surface. The second gateinsulating layer 160 may include an inorganic insulating material suchas silicon nitride, silicon oxide, silicon oxynitride, or the like.

The second gate electrode 170 may be disposed on the second gateinsulating layer 160. The second gate electrode 170 may overlap thefirst gate electrode 150. The second gate electrode 170 may include aconductive material such as molybdenum (Mo), copper (Cu), aluminum (Al),titanium (Ti), or the like. The first gate electrode 150 and the secondgate electrode 170 may form a capacitor CAP.

The interlayer insulating layer 180 may be disposed on the second gateelectrode 170. The interlayer insulating layer 180 may cover the secondgate electrode 170 on the second gate insulating layer 160. In anembodiment, the interlayer insulating layer 180 may have a uniformthickness along the profiles of the second gate insulating layer 160 andthe second gate electrode 170. In another embodiment, the interlayerinsulating layer 180 may have a flat upper surface. The interlayerinsulating layer 180 may include an inorganic insulating material suchas silicon nitride, silicon oxide, silicon oxynitride, or the like.

The source electrode 191 and the drain electrode 192 may be disposed onthe interlayer insulating layer 180. Each of the source electrode 191and the drain electrode 192 may be connected to the active layer 130through a contact hole formed in the first gate insulating layer 140,the second gate insulating layer 160, and the interlayer insulatinglayer 180. Each of the source electrode 191 and the drain electrode 192may include a conductive material such as molybdenum (Mo), copper (Cu),aluminum (Al), titanium (Ti), or the like. The active layer 130, thefirst gate electrode 150, the source electrode 191, and the drainelectrode 192 may form a transistor TR.

In an embodiment, as illustrated in FIG. 2 , the transistor TR may havea top-gate type structure in which the gate electrode 150 is disposed onthe active layer 130. However, the present invention is not limitedthereto, and in another embodiment, the transistor TR may have abottom-gate type structure in which the gate electrode is disposed underthe active layer.

The first planarization layer 200 may be disposed on the sourceelectrode 191 and the drain electrode 192. The first planarization layer200 may cover the source electrode 191 and the drain electrode 192 onthe interlayer insulating layer 180. The first planarization layer 200may have a flat upper surface. The first planarization layer 200 mayinclude an organic insulating material such as polyimide (PI) or thelike.

The first connection electrode 210 may be disposed on the firstplanarization layer 200. The first connection electrode 210 may beconnected to the source electrode 191 or the drain electrode 192 througha contact hole formed in the first planarization layer 200. In anembodiment, as illustrated in FIG. 2 , the first connection electrode210 may be connected to the drain electrode 192. However, the presentinvention is not limited thereto, and in another embodiment, the firstconnection electrode 210 may be connected to the source electrode 191.

The first connection electrode 210 may include a conductive materialsuch as molybdenum (Mo), copper (Cu), aluminum (Al), titanium (Ti), orthe like. In an embodiment, the first connection electrode 210 mayinclude aluminum (Al) and titanium (Ti). For example, the firstconnection electrode 210 may have a multilayer structure including atitanium (Ti) layer, an aluminum (Al) layer, and a titanium (Ti) layerthat are sequentially stacked.

The second planarization layer 220 may be disposed on the firstconnection electrode 210. The second planarization layer 220 may coverthe first connection electrode 210 on the first planarization layer 200.The second planarization layer 220 may have a flat upper surface. Thesecond planarization layer 220 may include an organic insulatingmaterial such as polyimide (PI) or the like.

The pixel electrode 250 may be disposed on the second planarizationlayer 220. The pixel electrode 250 may be connected to the firstconnection electrode 210 through a contact hole formed in the secondplanarization layer 220. The pixel electrode 250 may include aconductive material such as a metal, an alloy, a transparent conductiveoxide, or the like. In an embodiment, the pixel electrode 250 mayinclude silver (Ag) and indium tin oxide (ITO). For example, the pixelelectrode 250 may have a multilayer structure including an indium tinoxide (ITO) layer, a silver (Ag) layer, and an indium tin oxide (ITO)layer that are sequentially stacked.

The pixel defining layer 260 may be disposed on the pixel electrode 250.The pixel defining layer 260 may partially cover the pixel electrode 250on the second planarization layer 220. The pixel defining layer 260 mayhave a pixel opening exposing at least a portion of the pixel electrode250. In an embodiment, the pixel opening may expose a central portion ofthe pixel electrode 250, and the pixel defining layer 260 may cover aperipheral portion of the pixel electrode 250. The pixel defining layer260 may have a flat upper surface. The pixel defining layer 260 mayinclude an organic insulating material such as polyimide (PI) or thelike.

The emission layer 270 may be disposed on the pixel electrode 250. Theemission layer 270 may be disposed on the pixel electrode 250 exposed bythe pixel opening. The emission layer 270 may include at least one of anorganic light emitting material and a quantum dot.

In an embodiment, the organic light emitting material may include a lowmolecular weight organic compound or a high molecular weight organiccompound. For example, the low molecular weight organic compound mayinclude copper phthalocyanine, diphenylbenzidine(N,N′-diphenylbenzidine), tris-(8-hydroxyquinoline)aluminum), or thelike. The high molecular organic compound may includepolyethylenedioxythiophene, polyaniline, poly-phenylenevinylene,polyfluorene, or the like.

In an embodiment, the quantum dot may include a core including a groupII-VI compound, a group III-V compound, a group IV-VI compound, a groupIV element, a group IV compound, and combinations thereof. In anembodiment, the quantum dot may have a core-shell structure including acore and a shell surrounding the core. The shell may serve as aprotective layer to maintain semiconductor properties by preventingchemical modification of the core, and as a charging layer configured toimpart electrophoretic properties to the quantum dots.

The opposite electrode 280 may be disposed on the emission layer 270. Inan embodiment, the opposite electrode 280 may also be disposed on thepixel defining layer 260. The opposite electrode 280 may include aconductive material such as a metal, an alloy, a transparent conductiveoxide, or the like. For example, the conductive material may includealuminum (Al), platinum (Pt), silver (Ag), magnesium (Mg), gold (Au),chromium (Cr), tungsten (W), titanium (Ti), or the like. The pixelelectrode 250, the emission layer 270, and the opposite electrode 280may form the light emitting element EL.

FIG. 3 is a plan view illustrating the non-display area in FIG. 1 . FIG.4 is a cross-sectional view illustrating the display device 100 takenalong a line I-I′ in FIG. 3 .

Referring to FIGS. 1, 3, and 4 , the display device 100 may include afirst inorganic insulating layer 125, a second inorganic insulatinglayer 145, a third inorganic insulating layer 165, a fourth inorganicinsulating layer 185, a first organic insulating layer 205, a firstconductive layer 215, a second organic insulating layer 225, and atransparent conductive layer 255 disposed on the substrate 110 in thenon-display area NDA.

The first inorganic insulating layer 125 may be disposed on thesubstrate 110. The first inorganic insulating layer 125 may include aninorganic insulating material such as silicon nitride, silicon oxide,silicon oxynitride, or the like. In an embodiment, the first inorganicinsulating layer 125 may be disposed on the same layer as the bufferlayer 120. In such an embodiment, the material of the first inorganicinsulating layer 125 may be substantially the same as the material ofthe buffer layer 120.

The second inorganic insulating layer 145 may be disposed on the firstinorganic insulating layer 125. The second inorganic insulating layer145 may include an inorganic insulating material such as siliconnitride, silicon oxide, silicon oxynitride, or the like. In anembodiment, the second inorganic insulating layer 145 may be disposed onthe same layer as the first gate insulating layer 140. In such anembodiment, the material of the second inorganic insulating layer 145may be substantially the same as the material of the first gateinsulating layer 140.

The third inorganic insulating layer 165 may be disposed on the secondinorganic insulating layer 145. The third inorganic insulating layer 165may include an inorganic insulating material such as silicon nitride,silicon oxide, silicon oxynitride, or the like. In an embodiment, thethird inorganic insulating layer 165 may be disposed on the same layeras the second gate insulating layer 160. In such an embodiment, thematerial of the third inorganic insulating layer 165 may besubstantially the same as the material of the second gate insulatinglayer 160.

The fourth inorganic insulating layer 185 may be disposed on the thirdinorganic insulating layer 165. The fourth inorganic insulating layer185 may include an inorganic insulating material such as siliconnitride, silicon oxide, silicon oxynitride, or the like. In anembodiment, the fourth inorganic insulating layer 185 may be disposed onthe same layer as the interlayer insulating layer 180. In such anembodiment, the material of the fourth inorganic insulating layer 185may be substantially the same as the material of the interlayerinsulating layer 180.

The first organic insulating layer 205 may be disposed on the fourthinorganic insulating layer 185. The first organic insulating layer 205may include an organic insulating material such as polyimide (PI) or thelike. In an embodiment, the first organic insulating layer 205 may bedisposed on the same layer as the first planarization layer 200. In suchan embodiment, the material of the first organic insulating layer 205may be substantially the same as the material of the first planarizationlayer 200.

The first conductive layer 215 may be disposed on the first organicinsulating layer 205. The first conductive layer 215 may include aconductive material such as molybdenum (Mo), copper (Cu), aluminum (Al),titanium (Ti), or the like. In an embodiment, the first conductive layer215 may include aluminum (Al) and titanium (Ti). For example, the firstconductive layer 215 may have a multilayer structure including atitanium (Ti) layer, an aluminum (Al) layer, and a titanium (Ti) layerthat are sequentially stacked.

In an embodiment, the first conductive layer 215 may be disposed on thesame layer as the first connection electrode 210. In such an embodiment,the material of the first conductive layer 215 may be substantially thesame as the material of the first connection electrode 210.

The first conductive layer 215 may include first discharge holes DH1.The first discharge holes DH1 may pass through the first conductivelayer 215. The first discharge holes DH1 may be arranged at constantintervals in the first direction DR1 and the second direction DR2crossing the first direction DR1 in a plan view. In an embodiment, eachof the first discharge holes DH1 may have a rectangular planar shape.However, the present invention is not limited thereto, and in anotherembodiment, the planar shape of each of the first discharge holes DH1may be a polygonal shape, a circular shape, etc. other than therectangular shape.

The first discharge holes DH1 may serve as a passage to discharge gasgenerated in the first organic insulating layer 205. In the firstorganic insulating layer 205 including an organic insulating material,the gas may be generated by short-term or long-term chemicaldecomposition of moisture or the like. If the gas is not properlydischarged, the light emitting element EL disposed in the display areaDA may be damaged by the gas, which may cause a pixel shrinkage and areduction in the lifespan of the light emitting element EL. The firstdischarge holes DH1 may be formed in the first conductive layer 215, sothat the gas generated in the first organic insulating layer 205 may bedischarged through the first discharge holes DH1 and through the layersabove the first conductive layer 215.

The second organic insulating layer 225 may be disposed on the firstconductive layer 215. The second organic insulating layer 225 may coverthe first conductive layer 215 on the first organic insulating layer205. The second organic insulating layer 225 may include an organicinsulating material such as polyimide (PI) or the like. In anembodiment, the second organic insulating layer 225 may be disposed onthe same layer as the second planarization layer 220. In such anembodiment, the material of the second organic insulating layer 225 maybe substantially the same as the material of the second planarizationlayer 220.

The transparent conductive layer 255 may be disposed on the secondorganic insulating layer 225. The transparent conductive layer 255 mayinclude a conductive material such as a metal, an alloy, a transparentconductive oxide, or the like. In an embodiment, the transparentconductive layer 255 may include silver (Ag) and indium tin oxide (ITO).For example, the transparent conductive layer 255 may have a multilayerstructure including an indium tin oxide (ITO) layer, a silver (Ag)layer, and an indium tin oxide (ITO) layer that are sequentiallystacked.

In an embodiment, the transparent conductive layer 255 may be disposedon the same layer as the pixel electrode 250. In such an embodiment, thematerial of the transparent conductive layer 255 may be substantiallythe same as the material of the pixel electrode 250.

The transparent conductive layer 255 may include second discharge holesDH2. The second discharge holes DH2 may pass through the transparentconductive layer 255. The second discharge holes DH2 may be arranged atconstant intervals in the first direction DR1 and the second directionDR2 in the plan view. In an embodiment, each of the second dischargeholes DH2 may have a rectangular planar shape. However, the presentinvention is not limited thereto, and in another embodiment, the planarshape of each of the second discharge holes DH2 may be a polygonalshape, a circular shape, etc. other than the rectangular shape.

The second discharge holes DH2 may serve as a passage to discharge gasgenerated from the first organic insulating layer 205 and/or the secondorganic insulating layer 225. In the second organic insulating layer 225including an organic insulating material, the gas may be generated byshort-term or long-term chemical decomposition of moisture or the like.If the gas is not properly discharged, the light emitting element ELdisposed in the display area DA may be damaged by the gas, which maycause a pixel shrinkage and a reduction in the lifespan of the lightemitting element EL. The second discharge holes DH2 may be formed in thetransparent conductive layer 255, so that the gas generated in the firstorganic insulating layer 205 and/or the second organic insulating layer225 may be discharged through the second discharge holes DH2.

The second discharge holes DH2 may respectively overlap the firstdischarge holes DH1. In an embodiment, a width of each of the seconddischarge holes DH2 may be substantially equal to a width of each of thefirst discharge holes DH1.

In previous designs, the second discharge holes formed in thetransparent conductive layer may not respectively overlap or mayrespectively partially overlap the first discharge holes formed in thefirst conductive layer. In this case, a path through which gas isdischarged may be bent, and thus, gas generated in the first organicinsulating layer may not be smoothly discharged through the firstdischarge holes and the second discharge holes. Accordingly, the lightemitting element disposed in the display area may be damaged by the gas.

However, in the embodiments of the present invention, the seconddischarge holes DH2 formed in the transparent conductive layer 255 mayrespectively overlap, substantially entirely lining up with, the firstdischarge holes DH1 formed in the first conductive layer 215. In thiscase, a path through which gas is discharged may be formed in a verticaldirection, and accordingly, gas generated in the first organicinsulating layer 205 may be smoothly discharged through the firstdischarge holes DH1 and the second discharge holes DH2. Accordingly, thelight emitting element EL disposed in the display area DA may not bedamaged by the gas.

FIG. 5 is a plan view illustrating a display device according to anembodiment. FIG. 6 is a plan view illustrating an area II in FIG. 5 .

Referring to FIGS. 5 and 6 , the display device 100 according to anembodiment may include pixels PX disposed on the substrate 110 in thedisplay area DA, and a pad PD and a power line PL disposed on thesubstrate 110 in the non-display area NDA.

The pixels PX may be arranged in a substantially matrix form on thesubstrate 110 in the display area DA. In an embodiment, each of thepixels PX may include the transistor TR, the capacitor CAP, and thelight emitting element EL illustrated in FIG. 2 .

The non-display area NDA may include a first side portion SP1, a cornerportion CP extending from the first side portion SP1, and a second sideportion SP2 extending from the corner portion CP. Each of the first sideportion SP1 and the second side portion SP2 may have a straight shape,and the corner portion CP may have a curved shape. In an embodiment, thefirst side portion SP1 may correspond to a short side of the substrate110, and the second side portion SP2 may correspond to a long side ofthe substrate 110.

The pad PD may be disposed on the substrate 110 in the first sideportion SP1. The pad PD may be connected to a flexible printed circuitboard or the like to receive a power voltage from the flexible printedcircuit board.

The power line PL may be disposed on the substrate 110 in thenon-display area NDA, and may entirely surround the display area DA. Thepower line PL may be connected to the pad PD, and may extend along thefirst side portion SP1, the corner portion CP, and the second sideportion SP2. In an embodiment, the power line PL may include the firstconductive layer 215 and the transparent conductive layer 255illustrated in FIGS. 3 and 4 .

The power line PL may receive the power voltage from the pad PD, and mayprovide the power voltage to the pixels PX. The power line PL may beconnected to the pixels PX in the second side portion SP2. In anembodiment, the transparent conductive layer 255 of the power line PLmay be connected to the opposite electrode 280 in FIG. 2 of the lightemitting element EL of each of the pixels PX.

In an embodiment, the power line PL may include a first portion PL1 anda second portion PL2. The first portion PL1 may be spaced apart from thedisplay area DA by a first distance D1, and the second portion PL2 maybe spaced apart from the display area DA by a second distance D2 greaterthan the first distance D1. In other words, the second portion PL2 maybe farther from the display area DA than the first portion PL1. Thefirst portion PL1 may be substantially straight and slightly curved neara boundary with the second portion PL2. The second portion PL2 may besubstantially curved and extend toward the second side portion SP2.

In an embodiment, the first portion PL1 may be disposed on the substrate110 in the first side portion SP1. Further, the second portion PL2 maybe disposed on the substrate 110 in the corner portion CP and/or thesecond side portion SP2.

FIG. 7 is a plan view illustrating the non-display area NDA in FIG. 5that includes the first side portion SP1, the corner portion CP, and thesecond side portion SP2. For example, FIG. 7 may illustrate the cornerportion CP or the second side portion SP2 in FIG. 5 . FIG. 8 is across-sectional view illustrating the display device 100 taken along aline in FIG. 7 .

Referring to FIGS. 5, 6, 7, and 8 , the first conductive layer 215 mayfurther include third discharge holes DH3. The third discharge holes DH3may pass through the first conductive layer 215. The third dischargeholes DH3 may be arranged at constant intervals in the first directionDR1 and the second direction DR2 in a plan view. In an embodiment, eachof the third discharge holes DH3 may have a rectangular planar shape.However, the present invention is not limited thereto, and in anotherembodiment, the planar shape of each of the third discharge holes DH3may be a polygonal shape, a circular shape, etc. other than therectangular shape.

The third discharge holes DH3 may serve as a passage to discharge gasgenerated in the first organic insulating layer 205. The third dischargeholes DH3 may be formed in the first conductive layer 215, so that thegas generated in the first organic insulating layer 205 may bedischarged through the third discharge holes DH3.

The transparent conductive layer 255 may further include fourthdischarge holes DH4. The fourth discharge holes DH4 may pass through thetransparent conductive layer 255. The fourth discharge holes DH4 may bearranged at constant intervals in the first direction DR1 and the seconddirection DR2 in the plan view. In an embodiment, each of the fourthdischarge holes DH4 may have a rectangular planar shape. However, thepresent invention is not limited thereto, and in another embodiment, theplanar shape of each of the fourth discharge holes DH4 may be apolygonal shape, a circular shape, etc. other than the rectangularshape.

The fourth discharge holes DH4 may serve as a passage to discharge gasgenerated in the first organic insulating layer 205 and/or the secondorganic insulating layer 225. The fourth discharge holes DH4 may beformed in the transparent conductive layer 255, so that the gasgenerated in the first organic insulating layer 205 and/or the secondorganic insulating layer 225 may be discharged through the fourthdischarge holes DH4.

The fourth discharge holes DH4 may not respectively overlap the thirddischarge holes DH3. Meaning, the fourth discharge holes DH4 do notsubstantially line up with the third discharge holes DH3 as illustratedin FIG. 4 . In an embodiment, the third discharge holes DH3 and thefourth discharge holes DH4 may be alternately disposed in the plan view.For example, the third discharge holes DH3 and the fourth dischargeholes DH4 may be alternately arranged along the first direction DR1. Asillustrated in FIG. 8 , edge portions E1 of the transparent conductivelayer 255 may overlap with edge portions E2 of the first conductivelayer 215.

In an embodiment, the first discharge holes DH1 in FIG. 3 and the seconddischarge holes DH2 in FIG. 3 may be disposed in the first portion PL1of the power line PL, and the third discharge holes DH3 and the fourthdischarge holes DH4 may be disposed in the second portion PL2 of thepower line PL.

Compared with the first portion PL1 of the power line PL in which thefirst discharge holes DH1 and the second discharge holes DH2 overlappingeach other are disposed as in FIGS. 3 and 4 , in the second portion PL2of the power line PL in which the third discharge holes DH3 and thefourth discharge holes DH4 not overlapping each other are disposed as inFIGS. 7 and 8 , the gas generated in the first organic insulating layer205 may not be relatively smoothly discharged through the thirddischarge holes DH3 and the fourth discharge holes DH4. However, becausethe second portion PL2 is farther from the display area DA than thefirst portion PL1, the effect of the gas generated in the second portionPL2 to the light emitting element EL disposed in the display area DA maybe relatively small such that the non-overlapping arrangement alsoproves effective.

Compared with the first portion PL1 of the power line PL in which thefirst discharge holes DH1 and the second discharge holes DH2 overlappingeach other are disposed, a surface area of the second portion PL2 of thepower line PL in which the third discharge holes DH3 and the fourthdischarge holes DH4 not overlapping each other are disposed may berelatively large. Accordingly, when the second portion PL2 of the powerline PL contacts the opposite electrode 280 of the light emittingelement EL, the contact resistance between the power line PL and theopposite electrode 280 of the light emitting element EL may decrease,and accordingly, a voltage drop and a delay of the power voltageprovided by the power line PL to the opposite electrode 280 of the lightemitting element EL may be prevented.

FIGS. 9 and 10 are cross-sectional views illustrating a display deviceaccording to another embodiment. FIGS. 9 and 10 may illustrateembodiments of the display area DA and the non-display area NDA of thedisplay device 100 in FIG. 1 , respectively.

Descriptions on elements of the display device described with referenceto FIGS. 9 and 10 , which are substantially the same as or similar tothe display device described with reference to FIGS. 2 and 4 , will notbe repeated.

Referring to FIGS. 1 and 9 , the display device 100 may further includea second connection electrode 230 and a third planarization layer 240disposed in the display area DA.

The second connection electrode 230 may be disposed between the secondplanarization layer 220 and the pixel electrode 250. The secondconnection electrode 230 may connect the first connection electrode 210and the pixel electrode 250. The second connection electrode 230 may beconnected to the first connection electrode 210 through a contact holeformed in the second planarization layer 220.

The second connection electrode 230 may include a conductive materialsuch as molybdenum (Mo), copper (Cu), aluminum (Al), titanium (Ti), orthe like. In an embodiment, the second connection electrode 230 mayinclude aluminum (Al) and titanium (Ti). For example, the secondconnection electrode 230 may have a multilayer structure including atitanium (Ti) layer, an aluminum (Al) layer, and a titanium (Ti) layerthat are sequentially stacked.

The third planarization layer 240 may be disposed between the secondconnection electrode 230 and the pixel electrode 250. The thirdplanarization layer 240 may cover the second connection electrode 230 onthe second planarization layer 220. The third planarization layer 240may have a flat upper surface. The third planarization layer 240 mayinclude an organic insulating material such as polyimide (PI) or thelike.

Referring to FIGS. 1, 9, and 10 , the display device 100 may furtherinclude a second conductive layer 235 and a third organic insulatinglayer 245 disposed in the non-display area NDA.

The second conductive layer 235 may be disposed between the secondorganic insulating layer 225 and the transparent conductive layer 255.The second conductive layer 235 may include a conductive material suchas molybdenum (Mo), copper (Cu), aluminum (Al), titanium (Ti), or thelike. In an embodiment, the second conductive layer 235 may includealuminum (Al) and titanium (Ti). For example, the second conductivelayer 235 may have a multilayer structure including a titanium (Ti)layer, an aluminum (Al) layer, and a titanium (Ti) layer that aresequentially stacked.

In an embodiment, the second conductive layer 235 may be disposed on thesame layer as the second connection electrode 230. In such anembodiment, the material of the second conductive layer 235 may besubstantially the same as the material of the second connectionelectrode 230.

The second conductive layer 235 may include fifth discharge holes DH5.The fifth discharge holes DH5 may pass through the second conductivelayer 235. In an embodiment, each of the fifth discharge holes DH5 mayhave a rectangular planar shape. However, the present invention is notlimited thereto, and in another embodiment, a planar shape of each ofthe fifth discharge holes DH5 may be a polygonal shape, a circularshape, etc. other than the rectangular shape.

The fifth discharge holes DH5 may serve as a passage to discharge gasgenerated from the first organic insulating layer 205 and/or the secondorganic insulating layer 225. The fifth discharge holes DH5 may beformed in the second conductive layer 235, so that the gas generated inthe first organic insulating layer 205 and/or the second organicinsulating layer 225 may be discharged through the fifth discharge holesDH5.

The fifth discharge holes DH5 may respectively overlap the firstdischarge holes DH1. In an embodiment, a width of each of the fifthdischarge holes DH5 may be substantially equal to the width of each ofthe first discharge holes DH1. In such an embodiment, the fifthdischarge holes DH5 may respectively overlap the second discharge holesDH2, and the width of each of the fifth discharge holes DH5 may besubstantially equal to the width of each of the second discharge holesDH2.

The third organic insulating layer 245 may be disposed between thesecond conductive layer 235 and the transparent conductive layer 255.The third organic insulating layer 245 may cover the second conductivelayer 235 on the second organic insulating layer 225. The third organicinsulating layer 245 may include an organic insulating material such aspolyimide (PI) or the like. In an embodiment, the third organicinsulating layer 245 may be disposed on the same layer as the thirdplanarization layer 240. In such an embodiment, the material of thethird organic insulating layer 245 may be substantially the same as thematerial of the third planarization layer 240.

The display device according to the embodiments may be applied to adisplay device included in a computer, a notebook, a mobile phone, asmartphone, a smart pad, a PMP, a PDA, an MP3 player, or the like.

Although the display devices according to the embodiments have beendescribed with reference to the drawings, the illustrated embodimentsare examples, and may be modified and changed by a person havingordinary knowledge in the relevant technical field without departingfrom the technical spirit described in the following claims.

What is claimed is:
 1. A display device, comprising: a substrateincluding a display area and a non-display area surrounding at least aportion of the display area; a first organic insulating layer disposedon the substrate in the non-display area; a first conductive layerdisposed on the first organic insulating layer and including firstdischarge holes; a second organic insulating layer disposed on the firstconductive layer; and a transparent conductive layer disposed on thesecond organic insulating layer and including second discharge holesthat substantially entirely line up with the first discharge holes. 2.The display device of claim 1, wherein a width of each of the seconddischarge holes is equal to a width of each of the first dischargeholes.
 3. The display device of claim 1, wherein the first conductivelayer includes aluminum (Al) and titanium (Ti).
 4. The display device ofclaim 1, wherein the transparent conductive layer includes silver (Ag)and indium tin oxide (ITO).
 5. The display device of claim 1, whereineach of the first organic insulating layer and the second organicinsulating layer includes polyimide (PI).
 6. The display device of claim1, further comprising: pixels disposed on the substrate in the displayarea; and a power line disposed on the substrate in the non-displayarea, providing a power voltage to the pixels, and including the firstconductive layer and the transparent conductive layer.
 7. The displaydevice of claim 6, wherein the power line includes a first portionspaced apart from the display area by a first distance and a secondportion spaced apart from the display area by a second distance greaterthan the first distance, and wherein the first discharge holes and thesecond discharge holes are disposed in the first portion.
 8. The displaydevice of claim 7, wherein the first conductive layer further includesthird discharge holes, wherein the transparent conductive layer furtherincludes fourth discharge holes that do not respectively overlap thethird discharge holes, and wherein the third discharge holes and thefourth discharge holes are disposed in the second portion.
 9. Thedisplay device of claim 8, wherein the third discharge holes and thefourth discharge holes are alternately disposed in a plan view.
 10. Thedisplay device of claim 8, wherein the non-display area includes a firstside portion in which a pad connected to the power line is disposed, acorner portion extending from the first side portion and having a curvedshape, and a second side portion extending from the corner portion andhaving a straight shape, and wherein the first portion is disposed inthe first side portion.
 11. The display device of claim 10, wherein thesecond portion is disposed in the corner portion.
 12. The display deviceof claim 10, wherein the second portion is disposed in the second sideportion.
 13. The display device of claim 1, further comprising: atransistor disposed on the substrate in the display area; a firstplanarization layer disposed on the transistor; a first connectionelectrode disposed on the first planarization layer and connected to thetransistor; a second planarization layer disposed on the firstconnection electrode; a pixel electrode disposed on the secondplanarization layer and connected to the first connection electrode; anemission layer disposed on the pixel electrode; and an oppositeelectrode disposed on the emission layer.
 14. The display device ofclaim 13, wherein the first organic insulating layer is disposed on asame layer as the first planarization layer, wherein the firstconductive layer is disposed on a same layer as the first connectionelectrode, wherein the second organic insulating layer is disposed on asame layer as the second planarization layer, and wherein thetransparent conductive layer is disposed on a same layer as the pixelelectrode.
 15. The display device of claim 14, further comprising: asecond conductive layer disposed between the second organic insulatinglayer and the transparent conductive layer and including fifth dischargeholes that respectively overlap the first discharge holes; and a thirdorganic insulating layer disposed between the second conductive layerand the transparent conductive layer.
 16. The display device of claim15, wherein the second conductive layer includes aluminum (Al) andtitanium (Ti).
 17. The display device of claim 15, wherein the thirdorganic insulating layer includes polyimide (PI).
 18. The display deviceof claim 15, further comprising: a second connection electrode disposedbetween the second planarization layer and the pixel electrode andconnecting the first connection electrode and the pixel electrode; and athird planarization layer disposed between the second connectionelectrode and the pixel electrode.
 19. The display device of claim 18,wherein the second conductive layer is disposed on a same layer as thesecond connection electrode, and wherein the third organic insulatinglayer is disposed on a same layer as the third planarization layer. 20.The display device of claim 14, wherein the transparent conductive layeris connected to the opposite electrode.